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IOP Conference Series: Materials Science and Engineering - 2021 : Implementing student attendance system using fingerprint biometrics for kolej universiti poly-tech mara

Lamin, N Zakiah and Wan Jusoh, WN Asnida and Zainudin, Juanita and Samad, Hafiza (2021) IOP Conference Series: Materials Science and Engineering - 2021 : Implementing student attendance system using fingerprint biometrics for kolej universiti poly-tech mara. IOP Conference Series: Materials Science and Engineering, 1062 (1). 0-2. ISSN 1757-899X

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Abstract

Recording students’ attendance has been a major concern at Kolej Universiti Poly Tech Mara. However, monitoring the attendance manually is a cumbersome issue to lecturers as students tend to manipulate the attendance by signing each other’s attendance. It has been found that fingerprint biometrics is capable to monitor the attendance systematically and efficiently. The aim of this study is to verify the students’ attendance using fingerprint biometrics. Evolutionary prototyping model were used to develop the students’ attendance system. Students are required to thumbprint using the fingerprint device installed in the classroom to record the students’ attendance. Their fingerprint images were captured by the fingerprint device and the images were then registered to the server for attendance process. The implementation of fingerprint biometric has helped lecturers to monitor the attendance of the students more systematic, efficient and ethically. By using the system embedded with biometrics, reporting on absenteeism is genuine and easy. Lecturers just need to print out and do necessary action. Therefore, fingerprint biometrics is useful and helpful in keeping track and managing the attendance of the students.

Item Type: Article
Uncontrolled Keywords: Fingerprint; biometrics; student attendance; systematic; trustworthy
Divisions: Institute of Graduate Studies (IGS)
Depositing User: LIBRARY1 UPTM
Date Deposited: 29 Jul 2025 07:59
Last Modified: 29 Jul 2025 07:59
URI: http://eprints.kuptm.edu.my/id/eprint/5064

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